標題: Effect of rapid-thermal-annealed TiN barrier layer on the Pt/BST/Pt capacitors prepared by RF magnetron co-sputter technique at low substrate temperature
作者: Hwang, CC
Juang, MH
Lai, MJ
Jaing, CC
Chen, JS
Huang, S
Cheng, HC
電子工程學系及電子研究所
Department of Electronics Engineering and Institute of Electronics
關鍵字: barium strontium titanate (BST);inter-diffusion;barrier layer;rapid-thermal anneal (RTA);low substrate temperature
公開日期: 1-Jan-2001
摘要: This investigation reports the effect of rapid-thermal-annealing (RTA) on metallic barrier TiN against the interdiffusions of Ti and Si into barium strontium titanate (BST) in Pt/BST/Pt/TiN/Ti/Si capacitors. In the integration of BST capacitors, the thermal budget of the BST deposition would cause the inter-diffusions of Ti and Si from Ti adhesion layer and Si plug respectively. This event would degrade the BST capacitors. To address this issue. rapid-thermal-annealed TiN barriers were deposited between the bottom electrode Pt and adhesion layer Ti. Optimal RTA condition for TiN were found ill this: experiment. Excellent electrical characteristics of Pt/BST/Pt/TiN/Ti/Si capacitors. including high dielectric constant (epsilon (r) = 320). low leakage current (1.5 x 10(-8) A/cm(2)) under 0.1 MV/cm, and greater than 10 year lifetime under 1.6 MV/cm were obtained with Ar + O-2 mixed ambient at a low substrate temperature (300 degreesC). (C) 2001 Elsevier Science Ltd. All rights reserved.
URI: http://dx.doi.org/10.1016/S0038-1101(00)00235-5
http://hdl.handle.net/11536/29925
ISSN: 0038-1101
DOI: 10.1016/S0038-1101(00)00235-5
期刊: SOLID-STATE ELECTRONICS
Volume: 45
Issue: 1
起始頁: 121
結束頁: 125
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