完整後設資料紀錄
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dc.contributor.authorChen, JHen_US
dc.contributor.authorLei, TFen_US
dc.contributor.authorChen, JHen_US
dc.contributor.authorChao, TSen_US
dc.date.accessioned2014-12-08T15:44:41Z-
dc.date.available2014-12-08T15:44:41Z-
dc.date.issued2000-11-01en_US
dc.identifier.issn0013-4651en_US
dc.identifier.urihttp://dx.doi.org/10.1149/1.1394054en_US
dc.identifier.urihttp://hdl.handle.net/11536/30168-
dc.description.abstractThe integrity of tetraethylorthosilicate (TEOS) polyoxide using chemical mechanical polishing (CMP) plus a high temperature rapid thermal annealing (RTA) step was studied in this work. The surface morphology of polysilicon is improved after a CMP process. Polyoxides deposited by low pressure chemical vapor deposition (LPCVD) TEOS in conjunction with CMP and RTA N-2/N2O annealing exhibit a better current-electric field (J-E) curve, higher charge to breakdown ratio, and lower electron trapping rate. In addition, the composite bilayer (TEOS deposited and thermally grown by RTA) polyoxide film introduces an asymmetry of electrical leakage current, trapping characterization, and charge to breakdown, with respect to the injection of different polarity (+V-g and -V-g) (C) 2000 The Electrochemical Society. S0013-4651(00)01-051-X. All rights reserved.en_US
dc.language.isoen_USen_US
dc.titleCharacteristics of TEOS polysilicon oxides: Improvement by CMP and high temperature RTA N-2/N2O annealingen_US
dc.typeArticleen_US
dc.identifier.doi10.1149/1.1394054en_US
dc.identifier.journalJOURNAL OF THE ELECTROCHEMICAL SOCIETYen_US
dc.citation.volume147en_US
dc.citation.issue11en_US
dc.citation.spage4282en_US
dc.citation.epage4288en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000090053700049-
dc.citation.woscount9-
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