標題: Using inverse modeling to estimate the incident heat flux required to achieve temperature uniformity across a circular disk
作者: Lin, S
Chu, HS
機械工程學系
Department of Mechanical Engineering
公開日期: 1-Oct-2000
摘要: This article presents a systematic inverse modeling analysis for estimating the incident heat flux required to achieve temperature uniformity across a circular disk during thermal processing. A one-dimensional thermal model, temperature-dependent thermal properties of silicon, and a future-time algorithm of inverse heat transfer method are used. Vertical and lateral edge-heat compensations on the perimeter are discussed. The required edge-heat compensations for maintaining uniform temperature across 100-mm-diameter (0.6-min-thick), 150-mm-diameter (0.675-mm-thick), 200-mm-diameter (0.725-mm-thick), and 300-mm-diameter (0.775-mm-thick) silicon disks are evaluated intuitively using inverse modeling. Our numerical results show that temperature uniformity can be efficiently achieved using inverse modeling. The resulting maximum temperature differences in our present study were only 0.279, 0.583, 0.989, and 0.178 degreesC across 100-, 150-, 200- and 300-mm-diameter disks, respectively.
URI: http://hdl.handle.net/11536/30235
ISSN: 1089-3954
期刊: MICROSCALE THERMOPHYSICAL ENGINEERING
Volume: 4
Issue: 4
起始頁: 245
結束頁: 260
Appears in Collections:Articles