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dc.contributor.authorKer, MDen_US
dc.contributor.authorChen, TYen_US
dc.contributor.authorWu, CYen_US
dc.contributor.authorChang, HHen_US
dc.date.accessioned2014-12-08T15:44:57Z-
dc.date.available2014-12-08T15:44:57Z-
dc.date.issued2000-08-01en_US
dc.identifier.issn0018-9200en_US
dc.identifier.urihttp://dx.doi.org/10.1109/4.859509en_US
dc.identifier.urihttp://hdl.handle.net/11536/30351-
dc.description.abstractAn electrostatic discharge (ESD) protection design is proposed to solve the ESD protection challenge to the analog pins for high-frequency or current-mode applications. By including an efficient power-rails clamp circuit into the analog input/output (I/O) pin, the device dimension (W/L) of an ESD clamp device connected to the I/O pad in the analog ESD protection circuit can be reduced to only 50/0.5 (mu m/mu m) in a 0.35-mu m silicided CMOS process, but it can sustain the human body model (HBM) and machine model (MM) ESD level of up to 6 kV (400 V). With such a smaller device dimension, the input capacitance of this analog ESD protection circuit can be significantly reduced to only similar to 1.0 pF (including the bond-pad capacitance) for high-frequency applications.en_US
dc.language.isoen_USen_US
dc.subjectanalog pinen_US
dc.subjectelectrostatic dischargeen_US
dc.subjectESDen_US
dc.subjectinput capacitanceen_US
dc.subjecton-chip ESD protection circuiten_US
dc.titleESD protection design on analog pin with very low input capacitance for high-frequency or current-mode applicationsen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/4.859509en_US
dc.identifier.journalIEEE JOURNAL OF SOLID-STATE CIRCUITSen_US
dc.citation.volume35en_US
dc.citation.issue8en_US
dc.citation.spage1194en_US
dc.citation.epage1199en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000088717000015-
dc.citation.woscount42-
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