Title: Thermally driven polysilicon actuators for lateral displacement
Authors: Wu, MF
Lin, CH
Hsu, WS
機械工程學系
Department of Mechanical Engineering
Issue Date: 1-May-1999
Abstract: A novel one-mask; polysilicon actuator driven by thermal expansion is developed, modeled and tested. The structures are heated by electric current due to resistive dissipation. Thermal strain is magnified by two mechanical mechanisms-lever and parallelogram. The device is tested in air and has a lateral 8 mu m-displacement by applying a low voltage (below 3.5 V). The critical current to reach melting point is about 67 mA with the input voltage less than 5 V. The simulation results by analytical and FEM schemes are compared with experimental data. The maximum output forces is measured with a built-in cantilever beam and is calculated to be about 3.3 mu N.
URI: http://dx.doi.org/10.1106/KX2A-2JG7-LRUV-6C2A
http://hdl.handle.net/11536/31385
ISSN: 1045-389X
DOI: 10.1106/KX2A-2JG7-LRUV-6C2A
Journal: JOURNAL OF INTELLIGENT MATERIAL SYSTEMS AND STRUCTURES
Volume: 10
Issue: 5
Begin Page: 402
End Page: 409
Appears in Collections:Articles