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dc.contributor.authorWang, Terry Tai-Juien_US
dc.contributor.authorChu, Chang-Lungen_US
dc.contributor.authorHsieh, Ing-Jaren_US
dc.contributor.authorTseng, Wen-Shouen_US
dc.date.accessioned2014-12-08T15:48:06Z-
dc.date.available2014-12-08T15:48:06Z-
dc.date.issued2010-10-04en_US
dc.identifier.issn0003-6951en_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.3498049en_US
dc.identifier.urihttp://hdl.handle.net/11536/32084-
dc.description.abstractThis paper presents the formation of iridium nanocrystals (Ir-NCs) embedded in SiO(2) matrix and it can be used for potential applications of nonvolatile memory devices. The NC formation is investigated by varying Ir film thickness; and the thermal agglomeration is also studied by applying various annealing temperatures and process time. The results of systematic characterization including capacitance-voltage, transmission electron microscopy, and x-ray photoelectron spectroscopy show that the high work-function (5.27 eV) metallic-NCs have a highly thermal stability (up to 900 degrees C) and the resulted Al/SiO(2)/Ir-NCs/SiO(2)/Si/Al stack can have a good retention ability and significant hysteresis window of 17.4 V. (C) 2010 American Institute of Physics. [doi:10.1063/1.3498049]en_US
dc.language.isoen_USen_US
dc.titleFormation of iridium nanocrystals with highly thermal stability for the applications of nonvolatile memory device with excellent trapping abilityen_US
dc.typeArticleen_US
dc.identifier.doi10.1063/1.3498049en_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.citation.volume97en_US
dc.citation.issue14en_US
dc.citation.spageen_US
dc.citation.epageen_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.department材料科學與工程學系奈米科技碩博班zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.contributor.departmentGraduate Program of Nanotechnology , Department of Materials Science and Engineeringen_US
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