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dc.contributor.authorHuang, TYen_US
dc.contributor.authorJong, FCen_US
dc.contributor.authorChao, TSen_US
dc.contributor.authorLin, HCen_US
dc.contributor.authorLeu, LYen_US
dc.contributor.authorYoung, Ken_US
dc.contributor.authorLin, CHen_US
dc.contributor.authorChiu, KYen_US
dc.date.accessioned2014-12-08T15:48:56Z-
dc.date.available2014-12-08T15:48:56Z-
dc.date.issued1998-07-01en_US
dc.identifier.issn0741-3106en_US
dc.identifier.urihttp://dx.doi.org/10.1109/55.701435en_US
dc.identifier.urihttp://hdl.handle.net/11536/32550-
dc.description.abstractThe effects of an N2O anneal on the radiation effects of a split-gate electrical erasable programmable read only memory (EEPROM)/flash cell with a recently-proposed horn-shaped floating gate were studied. We have found that although the cells appear to survive 1 Mrad(Si) Co-60 irradiation without data retention failure, the write/erase cycling endurance was severely impeded after irradiation. Specifically, the write/erase cycling endurance was degraded to 20 K from the pre-irradiation value of 50 K, However, by adding an N2O annealing step after the interpoly oxidation, the after-irradiation write/erase cycling endurance of the resultant cell can be significantly improved to over 45 K, N2O annealing also improves the after-irradiation program and erase efficiencies. The N2O annealing step therefore presents a potential method for enhancing the robustness of the horn-shaped floating-gate EEPROM/flash cells for radiation-hard applications.en_US
dc.language.isoen_USen_US
dc.titleImproving radiation hardness of EEPROM/flash cell by N2O annealingen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/55.701435en_US
dc.identifier.journalIEEE ELECTRON DEVICE LETTERSen_US
dc.citation.volume19en_US
dc.citation.issue7en_US
dc.citation.spage256en_US
dc.citation.epage258en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000074366900015-
dc.citation.woscount6-
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