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dc.contributor.authorWU, CYen_US
dc.contributor.authorKER, MDen_US
dc.contributor.authorLEE, CYen_US
dc.contributor.authorKO, Jen_US
dc.date.accessioned2014-12-08T15:04:59Z-
dc.date.available2014-12-08T15:04:59Z-
dc.date.issued1992-03-01en_US
dc.identifier.issn0018-9200en_US
dc.identifier.urihttp://dx.doi.org/10.1109/4.121548en_US
dc.identifier.urihttp://hdl.handle.net/11536/3502-
dc.description.abstractA new CMOS on-chip electrostatic discharge (ESD) protection circuit which consists of dual parasitic SCR structures is proposed and investigated. Experimental results show that with a small layout area of 8800-mu-m2, the protection circuit can successfully perform negative and positive ESD protection with failure thresholds greater than +/- 1 and +/- 10 kV in machine-mode (MM) and human-body-mode (HBM) testing, respectively. The low ESD trigger voltages in both SCR's can be readily achieved through proper circuit design and without involving device or junction breakdown. The input capacitance of the proposed protection circuit is very low and no diffusion resistor between I/O pad and internal circuits is required, so it is suitable for high-speed applications. Moreover, this ESD protection circuit is fully process compatible with CMOS technologies.en_US
dc.language.isoen_USen_US
dc.titleA NEW ON-CHIP ESD PROTECTION CIRCUIT WITH DUAL PARASITIC SCR STRUCTURES FOR CMOS VLSIen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/4.121548en_US
dc.identifier.journalIEEE JOURNAL OF SOLID-STATE CIRCUITSen_US
dc.citation.volume27en_US
dc.citation.issue3en_US
dc.citation.spage274en_US
dc.citation.epage280en_US
dc.contributor.department電控工程研究所zh_TW
dc.contributor.departmentInstitute of Electrical and Control Engineeringen_US
dc.identifier.wosnumberWOS:A1992HE80000006-
dc.citation.woscount12-
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