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dc.contributor.authorWU, SLen_US
dc.contributor.authorLEE, CLen_US
dc.contributor.authorLEI, TFen_US
dc.date.accessioned2014-12-08T15:05:03Z-
dc.date.available2014-12-08T15:05:03Z-
dc.date.issued1992-01-01en_US
dc.identifier.issn0741-3106en_US
dc.identifier.urihttp://dx.doi.org/10.1109/55.144939en_US
dc.identifier.urihttp://hdl.handle.net/11536/3577-
dc.description.abstractA high-performance polysilicon contacted shallow junction diode formed by using a stacked-amorphous-silicon (SAS) film as the diffusion source is reported. The diode-exhibited a very low leakage current (less-than-or-equal-to 1 nA/cm2 at -5 V), a very high breakdown voltage (greater-than-or-equal-to 100 V), and a forward ideality factor m less-than-or-equal-to 1.05 over 7 decades.en_US
dc.language.isoen_USen_US
dc.titleHIGH-PERFORMANCE POLYSILICON CONTACTED SHALLOW JUNCTIONS FORMED BY STACKED-AMORPHOUS-SILICON FILMSen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/55.144939en_US
dc.identifier.journalIEEE ELECTRON DEVICE LETTERSen_US
dc.citation.volume13en_US
dc.citation.issue1en_US
dc.citation.spage23en_US
dc.citation.epage25en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:A1992GV84800008-
dc.citation.woscount4-
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