標題: DIRECT EVIDENCE OF GATE OXIDE THICKNESS INCREASE IN TUNGSTEN POLYCIDE PROCESSES
作者: HSU, SL
LIU, LM
LIN, MS
CHANG, CY
電子工程學系及電子研究所
Department of Electronics Engineering and Institute of Electronics
公開日期: 1-Nov-1991
摘要: The increase of the "effective" gate oxide thickness for W-polycide processes is studied. The samples with as-deposited and annealed W polycide are analyzed by secondary ion mass spectrometry, transmission electron microscopy (TEM), and high-frequency CV measurements. The TEM cross section shows that the gate oxide thicknesses are approximately 244 and approximately 285 angstrom for as-deposited and 1000-degrees-C annealed samples, respectively. The TEM results agree with that from CV measurements. The TEM analyses provide a direct physical evidence of an additional oxide thickness (approximately 41 angstrom) during the W-polycide annealing.
URI: http://dx.doi.org/10.1109/55.119218
http://hdl.handle.net/11536/3648
ISSN: 0741-3106
DOI: 10.1109/55.119218
期刊: IEEE ELECTRON DEVICE LETTERS
Volume: 12
Issue: 11
起始頁: 623
結束頁: 625
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