標題: | DIRECT EVIDENCE OF GATE OXIDE THICKNESS INCREASE IN TUNGSTEN POLYCIDE PROCESSES |
作者: | HSU, SL LIU, LM LIN, MS CHANG, CY 電子工程學系及電子研究所 Department of Electronics Engineering and Institute of Electronics |
公開日期: | 1-Nov-1991 |
摘要: | The increase of the "effective" gate oxide thickness for W-polycide processes is studied. The samples with as-deposited and annealed W polycide are analyzed by secondary ion mass spectrometry, transmission electron microscopy (TEM), and high-frequency CV measurements. The TEM cross section shows that the gate oxide thicknesses are approximately 244 and approximately 285 angstrom for as-deposited and 1000-degrees-C annealed samples, respectively. The TEM results agree with that from CV measurements. The TEM analyses provide a direct physical evidence of an additional oxide thickness (approximately 41 angstrom) during the W-polycide annealing. |
URI: | http://dx.doi.org/10.1109/55.119218 http://hdl.handle.net/11536/3648 |
ISSN: | 0741-3106 |
DOI: | 10.1109/55.119218 |
期刊: | IEEE ELECTRON DEVICE LETTERS |
Volume: | 12 |
Issue: | 11 |
起始頁: | 623 |
結束頁: | 625 |
Appears in Collections: | Articles |
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