标题: 某一动态随机存取记忆体的碳足迹盘查之研究
The Study of the Carbon Footprint Inventory of a Dynamic Random Access Memory Chip
作者: 鄭景隆
Cheng, Ching-Lung
蔡春進
Tsai, Chuen-Jinn
工學院永續環境科技學程
关键字: 碳足迹;温室气体;生命周期评估;PAS2050;carbon footprint;greenhouse gases;life cycle assessment;PAS2050
公开日期: 2010
摘要: 本研究以产业温室气体(GHG)盘查为基础,加入“产品生命周期评估(LCA)”的概念,探讨某一半导体厂制造动态随机存取记忆体(DRAM)晶片所产生的温室气体排放量,以二氧化碳当量表示之,即是所谓产品碳足迹(Carbon Footprint)。
本计划以PAS2050为执行架构,并参考ISO14064-1及ISO14040的方法,计算产品碳足迹。盘查与计算的范畴包含原料提供、工厂制造、运输配送等生命周期活动阶段,藉由本计划执行达到以下目的:1.了解电子产品之碳足迹排放量2.提升公司形象并降低竞争压力,做为该电子产品前瞻者3.分析产品各生命周期阶段的排放量,寻找减碳之机会4.因应国际减碳议题,降低单位减碳成本5.绿化供应链,回应利害相关者关心的环境议题。
本产品系统边界采B2B(Business-to-Business),即企业至企业的评估方式,计算结果为产品供应链三阶段:原料取得、生产制造及成品运输的碳排放数据总和。本研究发现产品碳排放为0.71kg-CO2e/记忆体颗粒,其中以工厂生产制造过程占83.39 %贡献碳足迹最大,其次为原料取得的16.58%,及成品运输的0.03%,因此,分析将来工厂生产制造使用电力消耗最具有减碳的空间。
The greenhouse gases (GHG) emission of a dynamic random access memory (DRAM) product was studied. The emission was calculated as CO2 equivalence and defined as the carbon footprint (CFP). It was based on enterprise’s inventory of GHG emissions and the concept of product life cycle assessment (LCA).
The calculation of the product’s carbon footprint was based on the PAS 2050 and the standard methods of ISO14064-1 and ISO14040. The project scope of the inventory and calculation has three parts: the manufacturing of raw material, the manufacturing of product in the factory and transportation. The purposes of this study are:
1.To the carbon footprint emission of DRAM product
2.To improve the image of the company and reduce the pressure from competitors
3.To analyze the CO2 emission data and find the opportinities for carbon reduction
4.To respond to the international environmental issues and reduce cost of carbon reduction in the future
5.To form a green the supply chain.
The system boundary of the product carbon footprint assessment is B2B (Business-to-Business) and the calculated results of carbon emission data are divided into three parts:the manufacturing of raw material, the manufacturing of product in the factory and transportation. It was found that the carbon emission is 0.71kg-CO2e/chip with the biggest contribution of 83.39% from the manufacturing of product in the factory, followed by the manufacturing of raw material (16.58 %) and transportation (0.03%). The results indicate that we should reduce carbon emission about electric power consumption in the manufacturing process of the product as the first priority in the future.
URI: http://140.113.39.130/cdrfb3/record/nctu/#GT079476501
http://hdl.handle.net/11536/41016
显示于类别:Thesis


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