半導體業侷限空間作業化學性危害風險評估管控與改善對策-以A公司為例

Abstract

本論文研製之半導體廠內的儲槽、消化池等皆屬於侷限空間作業的場所，進入此環境內作業存有許多潛在危害因子，包含了物理性危害與化學性危害因子。本研究的目的在於掌握半導體廠從事侷限空間作業的項目，鑑別其作業程序中可能接觸的化學性危害因子，透過失誤模式及影響分析方法，明確得知危害性較高的作業節點與類別，並藉由風險控制與管理以及源頭規劃方法，以重大職業災害事故再發生。研究結果顯示，在63 項半導體廠侷限空間作業項目中發生危害機率較高的作業項目是在排水回收系統、酸排水回收系統、氫氟酸廢水回收系統、酸鹼廢水回收系統，其中又以氫氟酸廢水回收系統的比例是最高的；若發生事故時造成嚴重程度較高的項目是超純水系統、排水回收系統、酸排水回收系統、氫氟酸廢水回收系統、酸廢氣處理系統、NH3 廢氣處理系統，會對人員急性傷害或環境危害及人員慢性傷害等，若人員能在操作系統時，能夠小心謹慎遵循標準作業程序妥善處理並穿戴適當的防護用具，加上平時的教育訓練，得以降低意外傷害事故的發生。

A procedure is there are a lot of hidden hazard,including physical and chemical hazard, while working in confined space such as chemical tank and digestion tank in semiconductor foundry. In this study, in order to prevent the confined space accident, we collect the overall process which is related to chemical hazard in semiconductor confined space; then define the higher risk factor by FMEA (Failure mode and Effects Analysis) in these processes, and finally propose the strategy for these risk control and management.Base on the study, there are total 63 chemical hazard process in semiconductor foundry confined space, and we sort out the process with higher probability including water recycle system; acid recycle system; acid/alkaline mixed recycle system, and the most populate hazard process is HF recycle system. Another study focus on the process with more serious hazard including ultrapure water system; water recycle system; acid recycle system; HF recycle system; acidic gas process system; exhausted HF3 gas process system. These kinds of process cause immediate injury to people and environment. At the end of the study, we propose the stand operation procedure; operating with proper protective equipment and regular training course to avoid the accident.