無線射頻辨識系統在半導體設備維修保養之應用研究

Abstract

無線射頻辨識系統( Radio Frequency Identification , RFID)，為一種非接觸式自動識別系統，近年來在各地引發研究推廣的風潮，全球各地均積極投入研發運用，目前於各種產業之應用已慢慢成熟，而在半導體製造業方面的運用範圍不算普及。半導體產業具有製程複雜且成本相當昂貴之特性，一座12吋晶圓廠造價高達1000億，其中大多數成本是來自半導體設備，而在已量產之半導體廠，半導體設備維修保養成本佔營運成本比重相對較高，如何有效率管控眾多設備零件與校正儀器，便是一值得探討之課題。RFID 所具備之無線資料辨識及能同時讀取多筆資料且可運用於物品及人員位置之即時監控等特性，對目前高度自動化且製程甚長的半導體產業，將會是新一代進度控制利器。是故對如何應用及其適用性之探討發展，將成為產業管理技術提升的重要踏腳石。 本研究之目的係在探討RFID應用於半導體廠設備維修保養方面之可行性。藉由主動、被動式RFID Tag及特定PDA式 RFID Reader結合半導體廠特定維修計畫來建置本系統。透過本研究所選定的某半導體廠及其相關設備之實際運作驗證，顯示RFID系統可以應用於半導體廠設備維修保養上，在預防保養、設備巡檢及設備校正工具定位管理均可達預期的管理維護效益。依據本研究結果證明RFID 確可應用於半導體廠設備維修保養方面，惟要考慮的是成本稍高，另系統如欲達到最佳化須與RFID 廠商不斷檢討改善中介軟體成熟度，以達到e化及更人性之管理。

RFID, radio frequency identification system, is one kind of wireless and non-contact automatic identify system. Recently, the applications of RFID have been increasing more attention and widely applied in many different fields. However, there is few application of RFID in semiconductor manufacturing industry. The construction cost for a 12 inch wafer semiconductor factory is approximate as high as 100,000,000,000 NTD, in which majority costs are come from the corresponding semiconductor equipments. The cost of semiconductor equipments is rather expensive comparing with those in other fields. Hence, how to maintain these expensive and vital equipments in an operational state is important issue for this industry. This study presents three vary RFID semiconductor equipment maintain systems, including prevention maintenance system, equipment mobile inspection system, and calibration tool location verifing system. Based on SUMMIT middle software, the RFID maintain systems have been developed and verified. ETCH equipment, in TSMC, Hsinchu, is employed to test and verified the feasibility and performance of the proposed RFID semiconductor equipment maintain system. By comparing with traditional maintain system, the simulation results demonstrate the proposed maintain systems has capability of high management efficiency, reducing man power usage, and cost and time saving.