金屬環雷射之熱特性

Abstract

本論文中，我們直接接合方式將半導體材料接合在雙面拋光的藍寶石基板上，藍寶石基板有良好的導熱性外，再近紅外光也有良好的透光性和低折射率，適合在覆蓋金屬後，利用從藍寶石基板端注入能量和接收訊號的方式，解決金屬吸收大而難以接收訊號的問題。並且用模擬的方式來分析實驗結果。接著，我們用簡單的利用量測的方式，利用改變溫度及注入的能量來改變雷射波長，獲得熱阻值，也證實了當覆蓋金屬後，熱大部分都是藉由金屬層傳導。

In the thesis, the InGaAsP use wafer bonding on double polish sapphire. The sapphire has high thermal conductivity, low index and high transmission in NIR. We can use input power and accept sign for sapphire after coating metal. In order to solve the metal has high absorption that the sign is different accept if pumping from metal. And simulation used to compete with the measurement result. Next part, thermal resistance was estimated by measuring lasing wavelength shifting with temperature and pumping power variation individually. The major parts heat flux is contact by metal layer when coating metal.