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dc.contributor.authorLu, Yu-Lunen_US
dc.contributor.authorHsueh, Fu-Kuoen_US
dc.contributor.authorHuang, Kuo-Chingen_US
dc.contributor.authorCheng, Tz-Yenen_US
dc.contributor.authorKowalski, Jeff M.en_US
dc.contributor.authorKowalski, Jeff E.en_US
dc.contributor.authorLee, Yao-Jenen_US
dc.contributor.authorChao, Tien-Shengen_US
dc.contributor.authorWu, Ching-Yien_US
dc.date.accessioned2014-12-08T15:06:58Z-
dc.date.available2014-12-08T15:06:58Z-
dc.date.issued2010-05-01en_US
dc.identifier.issn0741-3106en_US
dc.identifier.urihttp://dx.doi.org/10.1109/LED.2010.2042924en_US
dc.identifier.urihttp://hdl.handle.net/11536/5452-
dc.description.abstractIn this letter, nanoscale p-MOS TFTs with a TiN gate electrode were realized using a novel microwave (MW) dopant-activation technique. We compared both low-temperature MW annealing and rapid thermal annealing. We successfully activated the source/drain region and suppressed the short-channel effects using low-temperature MW annealing. This technique is promising from the viewpoint of realizing high-performance and low-cost upper layer nanoscale transistors required for low-temperature 3-D integrated circuit fabrication.en_US
dc.language.isoen_USen_US
dc.subjectLow temperatureen_US
dc.subjectmetal gateen_US
dc.subjectmicrowave (MW) annealen_US
dc.subjectrapid thermal annealing (RTA)en_US
dc.titleNanoscale p-MOS Thin-Film Transistor With TiN Gate Electrode Fabricated by Low-Temperature Microwave Dopant Activationen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/LED.2010.2042924en_US
dc.identifier.journalIEEE ELECTRON DEVICE LETTERSen_US
dc.citation.volume31en_US
dc.citation.issue5en_US
dc.citation.spage437en_US
dc.citation.epage439en_US
dc.contributor.department電子物理學系zh_TW
dc.contributor.departmentDepartment of Electrophysicsen_US
dc.identifier.wosnumberWOS:000277047300019-
dc.citation.woscount5-
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