晶圓製造廠動態投料模式之構建

Abstract

隨著半導體製造技術的發展，晶圓製造廠型態也隨之變動﹐又由於製 程複雜度高､機台不穩定與產品特性不同﹐晶圓廠的不穩定度亦相對增高 。同時為加強顧客服務﹐會盡量接下顧客所要求的訂單型態﹐以致產品的 種類組合越來越複雜﹐且具高度不確定性﹐這些變異的特性往往造成主生 產排程預測不準確､細部排程規劃不準確､生產活動控制困難﹐因而更增 加生產管理的複雜度。本論文乃基於此一環境構建一動態投料的模式﹐以 解決半導體晶圓製造廠之投料問題。利用滾動式修正的概念﹐根據製造執 行系統所提供的即時資訊﹐動態地決定投料時點和投料順序。本論文並以 一實際晶圓廠例子﹐比較此動態投料模式和其它常用傳統投料方法的績效 ﹐在績效準則為總產出､週期時間､在製品數量､在製品週轉率､交期達 交率和瓶頸機台利用率之條件下﹐結果顯示此動態投料模式比其它傳統的 方法有較好的績效。 With the advance of new technology in semiconductor manufacturing, the wafer fabrication environment varies continuously. The process of wafer fabrication is perhaps the most complex manufacturing process nowadays. This complexity is, in part, the result of process intricacy, production diversity, and changing technologies. To improve customer service, the uncertainty of product mix also increases. These variabilities account for the difficulty of the production planning and control in this environment. This research presents a dynamic releasing scheme, which determines when and which wafer lot should be released into the shop floor using the concept of rolling correction. With real-time information from manufacturing execution system (MES), the priority and the time point of releasing is adjusted dynamically. The performance measures used in this study are throughput, cycle time, WIP, turn-rate, delivery, and bottleneck utilization. Results show that the proposed dynamic releasing scheme is better than other conventional strategies.