標題: 晶圓廠光罩產能分析與改善
Reticle Capacity Analysis and Improvement for a Wafer Fabrication Factory
作者: 鄭至偉
Chih Wei Cheng
李榮貴
Dr. Rong-Kwei Li
管理學院工業工程與管理學程
關鍵字: 光罩產能;測試曝光條件;迴歸分析;Reticle capacity;Testing exposure condition;Regression Analysis
公開日期: 2003
摘要: 光罩成本已成為各大晶圓廠及無晶圓廠的設計公司主要的產品成本之一,大家紛紛尋找方法降低其成本.經由對黃光區曝光對準流程進行分析發現, 流程中測試曝光條件的步驟可利用迴歸分析模式預測曝光條件,改善曝光對準流程中需要先測試曝光條件的步驟,如此能夠改善因為測試曝光條件而增加的生產週期,提昇光罩產能有效的利用率. 驗證結果在不需增加任何機台購置成本的情況下,可提升17%的產能.
The cost for reticle-making is one of the most substantial factors in most IC foundries and design houses and every company takes lot efforts to increase its utilization. After studying the entire process flow of the photo operations, the test exposure condition can be omitted by applying the regression analysis. This will save the use of the reticle and increase the reticle capacity. The pilot run showed that the study is feasible and 17% extra capacity is gained.
URI: http://140.113.39.130/cdrfb3/record/nctu/#GT009163508
http://hdl.handle.net/11536/62290
顯示於類別:畢業論文