完整後設資料紀錄
DC 欄位語言
dc.contributor.authorKuo, Chien-Ien_US
dc.contributor.authorHsu, Heng-Tungen_US
dc.contributor.authorChang, Edward Yien_US
dc.contributor.authorMiyamoto, Yasuyukien_US
dc.contributor.authorWu, Chien-Yingen_US
dc.contributor.authorChen, Yu-Linen_US
dc.contributor.authorHsiao, Yu-Linen_US
dc.date.accessioned2014-12-08T15:07:59Z-
dc.date.available2014-12-08T15:07:59Z-
dc.date.issued2010en_US
dc.identifier.issn0021-4922en_US
dc.identifier.urihttp://hdl.handle.net/11536/6278-
dc.identifier.urihttp://dx.doi.org/10.1143/JJAP.49.010212en_US
dc.description.abstractA 70 nm InAs channel quantum well field effect transistor (QWFET) fabricated by a narrowing source-drain (S/D) spacing technique was realized for future high-speed and logic applications. The S/D spacing was decreased from 3 to 0.65 mu m through a simple fabrication process, which is an ameliorative redeposition ohmic technique. The drain-source current density and transconductance of the device were increased from 391 to 517 mA/mm and from 946 to 1348 mS/mm after the scaling of the S/D spacing, respectively. In addition, the current gain cutoff frequency (f(T)) was also increased from 185 to 205 GHz. These results show that the easy method can effectively improve the III-V QWFET device performance for high-frequency and high-speed applications. (C) 2010 The Japan Society of Applied Physicsen_US
dc.language.isoen_USen_US
dc.titleDC and RF Performance Improvement of 70 nm Quantum Well Field Effect Transistor by Narrowing Source-Drain Spacing Technologyen_US
dc.typeArticleen_US
dc.identifier.doi10.1143/JJAP.49.010212en_US
dc.identifier.journalJAPANESE JOURNAL OF APPLIED PHYSICSen_US
dc.citation.volume49en_US
dc.citation.issue1en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000275607900012-
dc.citation.woscount0-
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