標題: | 特殊的垂直放射雷射元件的封裝結構 Novel Package Vertical Structure of Emission Laser |
作者: | 于世珩 Yu, Shi-Han 謝正雄 黃凱風 Shie, Jin-Shown Huang, Kai-Feng 電子物理系所 |
關鍵字: | 雷射;封裝 |
公開日期: | 1997 |
摘要: | 本論文欲以矽之異方性蝕刻技術,在矽晶片上製作一種具有四十
五度斜面之W型槽,並利用氧化犧牲法,使斜面更平整達光學程度。
在此結構上黏置邊射型半導體雷射,使其達到垂直發射的功能。此種
垂直發射的結構十分簡化雷射的包裝方式及成本。 This thesis is to study a novel technology of the fabrication of a vertical emitting semiconductor laser. This technique is a combination of an edgeemitting semiconductor laser and a silicon micro-machining W-groove which has forty-five degree mirror-like oblique planes made by oxidation- smooth method. With the edge emitting semiconductor laser packaged on the middle of the W-groove, reflected light will be perpendicular to the incident light, that is, as a vertical emitting semiconductor laser. This vertical emitting structure with simplifying laser package has the advantage for automation and cost lower. |
URI: | http://140.113.39.130/cdrfb3/record/nctu/#NT863429011 http://hdl.handle.net/11536/63429 |
顯示於類別: | 畢業論文 |