標題: 垂直發射的雷射封裝結構之製作
Fabrication of the package of vertical emitting semiconductor laser
作者: 李建昌
Li Jiann Chang
謝正雄
Shie Jin Shown
光電工程學系
關鍵字: 矽微加工;氧化犧牲法;silicon micromachining;oxidation-smooth method
公開日期: 1993
摘要: 本研究係利用矽之異方性蝕刻技術,在矽晶片上製作一種具有四十五度斜 面之U型槽,並利用此種氧化犧牲法,使斜面更平整至光學程度,在此結 構上黏置邊射型半導體雷射,使其達到垂直發射的功能。此種垂直發射之 結構十分簡化雷射包裝的方式,有利於自動化的優點。 This thesis is to study a novel technology of the fabrication of a vertical emitting semiconductor laser.this technique is a combination of an edge emitting semiconductor laser and a silicon micro-machining U-groove which has forty-five degree mirror-like oblique planes made by oxidation-smooth method.With the edge emitting semiconductor laser packaged on the bottom of the U-groove,reflected light will be perpendicular to the incident light,that is,as a vertical emitting semiconductor laser.This vertical emitting structure with simplifying laser package has the advantage for automation.
URI: http://140.113.39.130/cdrfb3/record/nctu/#NT820123020
http://hdl.handle.net/11536/57651
顯示於類別:畢業論文