標題: 應用福特8D及限制理論問題解決方法改善化學機械研磨製程總體設備效能
Applying Ford 8D and Theory of Constraints Problem Solving Discipline for OEE Improvement of CMP Process
作者: 王升暉
Sheng-Hui Wang
林家瑞
Chia-Shui Lin
工學院精密與自動化工程學程
關鍵字: 化學機械研磨;福特8D;限制理論;總體設備效能;CMP;Ford 8D,;Theory of Constraints (TOC);Overall Equipment Effectiveness (OEE)
公開日期: 2005
摘要: 在新一代半導體記憶體與邏輯元件的發展過程中,為了降低成本,在元件製程上有提昇深寬比及增加導線層數的趨勢。此時,在矽晶圓的拋光加工中表現卓著的精密研磨技術-化學機械研磨法(CMP)就被應用在半導體元件的平坦化製程。但此新製程有許多缺陷,所以本論文嘗試利用福特8D方法及限制理論來解決製程缺陷及高科技人員管理上的問題,而此方法是福特公司首先所發展出來的一團隊導向問題解決方法(Team–Oriented Problem Solving Discipline)。福特8D團隊導向問題解決法,近年來廣為極度要求改善時效性的高科技產業所引用,以進度控管、團隊導向著稱,但欠缺系統思考與決策溝通之方法。E.M.Goldratt 博士在1986年所創立之限制理論,著重系統限制之管理與突破。特別在系統政策限制上,Goldratt 博士更提倡用思考步驟(Thinking Process)來解決問題的方法,於1992年發展出一套有效圖形化、邏輯化的方法,以提供一易學易懂之政策限制問題的解決方法。本研究將結合以進度控管、組織團隊著稱之福特8D及限制理論來改善半導體化學機械研磨製程產品內不正常性微小刮傷及良率(Yield),進一步改善並提升化學研磨製程機台總體設備效能(Overall Equipment Effectiveness簡稱OEE)。透過本研究之過程及心得對福特8D與限制理論方法實施的狀況加以檢討,作為國內半導體公司推動產能效益改善之參考。
In new generation of semiconductor memory and logical device developing process, in order to reduce the cost, the tendency is to increase aspect ratio and add more metal layers. The Chemical Mechanical Polishing is applied to planarization process of semiconductor device. But this new process has many problems,therefore this thesis intends to solve the process and the high-technology personnel management problems using Ford 8D problem solving method. The Ford 8D problem solving method (Team-Oriented Problem Solving Discipline) was developed by Ford company. Even if Ford 8D was popularly applied to high technology enterprises it is lack of system oriented thinking & strategy communication methods. However, The Theory of Constraints (TOC) management solution developed by Dr. E.M. Goldratt in 1986 has major break-through for management problems with physical & policy constraints, Dr. Goldratt has recommended a thinking process to solve management problems with policy constraints. Dr. Goldratt developed an effective graphical and logical method in 1992 to handle policy constraints in management problems. This thesis presents a case study applying the integrated Ford 8D & TOC problem solving method for solving abnormal problems of micro-scratch, yield and OEE in semiconductor CMP manufacturing process. The details of the implementation are presented in this paper. Our learning experience of how to apply the TOC & Ford 8D problem solving method is also included in the thesis. This research will provide a reference for companies who are interested in applying Ford 8D and TOC problem solving method for OEE improvement in their organization. The Overall Equipment Effectiveness (OEE) of chemical mechanical polishing equipment can be improved significantly as documented by the actual production data in this thesis.
URI: http://140.113.39.130/cdrfb3/record/nctu/#GT009169527
http://hdl.handle.net/11536/64490
顯示於類別:畢業論文