标题: | 应用福特8D及限制理论问题解决方法改善化学机械研磨制程总体设备效能 Applying Ford 8D and Theory of Constraints Problem Solving Discipline for OEE Improvement of CMP Process |
作者: | 王升晖 Sheng-Hui Wang 林家瑞 Chia-Shui Lin 工学院精密与自动化工程学程 |
关键字: | 化学机械研磨;福特8D;限制理论;总体设备效能;CMP;Ford 8D,;Theory of Constraints (TOC);Overall Equipment Effectiveness (OEE) |
公开日期: | 2005 |
摘要: | 在新一代半导体记忆体与逻辑元件的发展过程中,为了降低成本,在元件制程上有提升深宽比及增加导线层数的趋势。此时,在矽晶圆的抛光加工中表现卓着的精密研磨技术-化学机械研磨法(CMP)就被应用在半导体元件的平坦化制程。但此新制程有许多缺陷,所以本论文尝试利用福特8D方法及限制理论来解决制程缺陷及高科技人员管理上的问题,而此方法是福特公司首先所发展出来的一团队导向问题解决方法(Team–Oriented Problem Solving Discipline)。福特8D团队导向问题解决法,近年来广为极度要求改善时效性的高科技产业所引用,以进度控管、团队导向着称,但欠缺系统思考与决策沟通之方法。E.M.Goldratt 博士在1986年所创立之限制理论,着重系统限制之管理与突破。特别在系统政策限制上,Goldratt 博士更提倡用思考步骤(Thinking Process)来解决问题的方法,于1992年发展出一套有效图形化、逻辑化的方法,以提供一易学易懂之政策限制问题的解决方法。本研究将结合以进度控管、组织团队着称之福特8D及限制理论来改善半导体化学机械研磨制程产品内不正常性微小刮伤及良率(Yield),进一步改善并提升化学研磨制程机台总体设备效能(Overall Equipment Effectiveness简称OEE)。透过本研究之过程及心得对福特8D与限制理论方法实施的状况加以检讨,作为国内半导体公司推动产能效益改善之参考。 In new generation of semiconductor memory and logical device developing process, in order to reduce the cost, the tendency is to increase aspect ratio and add more metal layers. The Chemical Mechanical Polishing is applied to planarization process of semiconductor device. But this new process has many problems,therefore this thesis intends to solve the process and the high-technology personnel management problems using Ford 8D problem solving method. The Ford 8D problem solving method (Team-Oriented Problem Solving Discipline) was developed by Ford company. Even if Ford 8D was popularly applied to high technology enterprises it is lack of system oriented thinking & strategy communication methods. However, The Theory of Constraints (TOC) management solution developed by Dr. E.M. Goldratt in 1986 has major break-through for management problems with physical & policy constraints, Dr. Goldratt has recommended a thinking process to solve management problems with policy constraints. Dr. Goldratt developed an effective graphical and logical method in 1992 to handle policy constraints in management problems. This thesis presents a case study applying the integrated Ford 8D & TOC problem solving method for solving abnormal problems of micro-scratch, yield and OEE in semiconductor CMP manufacturing process. The details of the implementation are presented in this paper. Our learning experience of how to apply the TOC & Ford 8D problem solving method is also included in the thesis. This research will provide a reference for companies who are interested in applying Ford 8D and TOC problem solving method for OEE improvement in their organization. The Overall Equipment Effectiveness (OEE) of chemical mechanical polishing equipment can be improved significantly as documented by the actual production data in this thesis. |
URI: | http://140.113.39.130/cdrfb3/record/nctu/#GT009169527 http://hdl.handle.net/11536/64490 |
显示于类别: | Thesis |