量測式電路板高壓縮熱傳模型的新方法

Abstract

面對近代日漸複雜的電子電路元件構裝設計，使得構裝體和板子的溫度模擬需求加重，然而傳統所設計的溫度模擬對電腦記憶體空間有大量的需求以及會耗費大量的模擬時間。因此，本論文將運用量測的方式，提出一種新發明的熱-電模型壓縮技術。這種壓縮技術可將傳統的三維原始熱模型，簡化成二維、一維甚至是點狀的壓縮熱模型，而且壓縮後的熱模型可建立其元件程式庫，並能輕易地藉使用程式庫元件而組成不同的電路板壓縮熱模型，進而迅速地模擬出整體溫度的分佈情況。最後，由模擬結果可以證明出我們的壓縮熱模型其正確性如同原始的三維熱模型，並使用最簡化的壓縮模型，更能將整體的模擬速度改進得比傳統方法快上千倍。

The packaging techniques of the electronic components have been greatly promoted in the recent years. The thermal simulation of the circuit packages or boards becomes more demanded. The conventional thermal simulation techniques take a lot of computation memory and time. Thus, this thesis proposes a new invented thermal-electrol compaction technique implemented by a measure method. The compaction method can reduce the conventional three-dimensional thermal model to two-dimensional, one-dimensional, or even the point compact models. The compact thermal models can be stored as library ones and easily reused to build the thermal models of the printed circuit boards. Our simulation results have shown that our compact thermal models are as accurate as the original three-dimensional ones and the simulation speed is improved a thousand times.