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dc.contributor.authorLin, Horng-Chihen_US
dc.contributor.authorChang, Kai-Hsiangen_US
dc.contributor.authorHuang, Tiao-Yuanen_US
dc.date.accessioned2014-12-08T15:08:26Z-
dc.date.available2014-12-08T15:08:26Z-
dc.date.issued2009-11-01en_US
dc.identifier.issn0018-9383en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TED.2009.2030871en_US
dc.identifier.urihttp://hdl.handle.net/11536/6522-
dc.description.abstractIn this paper, we employed a new test structure to characterize the alternating-current (ac) hot-carrier (HC)induced degradation in poly-Si thin-film transistors. High sensitivity in detecting the damage and the capability of directly resolving the damage location are demonstrated due to the unique feature of the test structure. Our results indicate that the major degradation is induced in the turn-off stages of the ac-stress signal when applied to the gate and in the turn-on stages of the ac-stress signal when applied to the drain. The availability and energy relaxation of channel HCs are considered to explain the experimental findings.en_US
dc.language.isoen_USen_US
dc.subjectAlternating-current (ac) stressen_US
dc.subjecthot carriers (HCs)en_US
dc.subjectreliabilityen_US
dc.subjectthin-film transistors (TFTs)en_US
dc.titleCharacterization of AC Hot-Carrier Effects in Poly-Si Thin-Film Transistorsen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/TED.2009.2030871en_US
dc.identifier.journalIEEE TRANSACTIONS ON ELECTRON DEVICESen_US
dc.citation.volume56en_US
dc.citation.issue11en_US
dc.citation.spage2664en_US
dc.citation.epage2669en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000271019500037-
dc.citation.woscount0-
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