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dc.contributor.author劉正淇en_US
dc.contributor.authorLiu Chen Chien_US
dc.contributor.author羅正忠en_US
dc.contributor.authorLou, Jen-Chungen_US
dc.date.accessioned2014-12-12T02:28:06Z-
dc.date.available2014-12-12T02:28:06Z-
dc.date.issued2001en_US
dc.identifier.urihttp://140.113.39.130/cdrfb3/record/nctu/#NT900428055en_US
dc.identifier.urihttp://hdl.handle.net/11536/68749-
dc.description.abstract本論文可分為兩個部分:在第一部份中,我們利用RTP的方式,成長一層薄氧化層;藉著改變不同成長溫度、時間和不同的回火條件,來研究這些因素對氧化層特性的影響。 在第二個部分中,我們在長氧化層前,先以離子佈植的方式打入氮分子離子。研究氮離子佈植量和不同成長條件對於氧化層特性之影響。 我們利用做出MOS電容來量測電性,並做比較。找出不同製程下的漏電流密度較小和較少的捕捉電賀的條件。zh_TW
dc.description.abstractThere are two parts in the thesis. In the first part, we use the rapid thermal process to grow a thin oxide layer. The factors including the growth temperature, growth times and different annealing conditions were controlled to find the relation between these factors and oxide qualities. In the second part, we studied the influence of N2+ implantation into Si substrate before oxidation. The leakage current obviously reduced at some implantation conditions. MOS capacitors were manufactured to measure the electric characteristics. The less charge density and leakage current density for the oxides are we expected.en_US
dc.language.isozh_TWen_US
dc.subject超薄氧化層zh_TW
dc.subject快速升溫zh_TW
dc.subject劉正淇zh_TW
dc.subjectthin oxideen_US
dc.subjectrapid thermalen_US
dc.subjectLiu Chen Chien_US
dc.title快速升溫氧化成長超薄氧化層研究zh_TW
dc.titleThe study of RTO thin oxidesen_US
dc.typeThesisen_US
dc.contributor.department電子研究所zh_TW
顯示於類別:畢業論文