半導體封裝業於IC整合元件之創新營運研究 - 以L,S公司的光學感測器產品為例

Abstract

中文摘要 台灣的半導體代工業在1990~2000年間，蓬勃發展；因此使得台灣在半導體業界佔有舉足輕重的角色，IC設計業全球第二，晶圓代工全球第一，IC封測代工服務也是全球第一 ; 但隨著時間的演進，中國、東南亞國家在半導體產業的積極發展，已使得台灣的代工業受到極大的挑戰，尤其是進入門檻較低的IC封測代工業。這"第一"的背後，似乎有著高產值低毛利的事實，如何使台灣的封裝產業能持續保持優勢，擺脫無止盡的殺價競爭；創新是我們熟知的必要方法。但企業如何集中資源，讓內部可正確和系統化的進行創新經營，是一值得研究的課題。 隨著智慧型產品應用的普及和成長力道的強勁，使得其重要的核心元件----光學感測器，成為一不可或缺的元件，其功能主要為強化人機介面。此產品主要應用於智慧型手機；根據IDC的統計資料，2012年全年全球智慧型手機出貨量達6.8億支，且在2013年需求將持續成長。而本研究的目的在以此一產品為例，探討半導體封裝業之經營模式；是否可在即有的資源基礎下，整合上下游。藉由產品的創新，克服低毛利的困境，改變經營模式，提升競爭力，克服產業面對的外部環境威脅，以追求永續經營。 本研究藉由L,S公司開發之智慧型新產品，分析經營模式，希望透過本個案的研究，能歸納出專業IC封裝代工產業創新經營的方向和建議，以期能走出低毛利的命運，及擺脫被淘汰的危機；讓台灣的IC封裝產業能再創商機，領先全球。

ABSTRACT The semiconductor industry in Taiwan was very prosperous during 1990~2000,which makes Taiwan plays an important role in this industry. Taiwan ranked number two in global IC design industry, and ranks number one in both foundry services and IC packaging and testing services in the world. The fast development of semiconductor industry in China and southeast countries challenges the manufacturing industry of Taiwan especially in IC assembly and testing. Although Taiwan ranked one in packaging and testing services, it suffers from the fact of high revenue and low gross margin. Therefore, it is necessary to be innovative for Taiwan’s packaging and testing industry in order to maintain a competitive advantage and get rid of price-cutting competition. It is worth studying that how can a company do to concentrate the resources and start an innovation management. With the growing of the application on intellectual product, optical sensor, the core component used to strengthen human-computer interface and mainly apply to smart phones, becomes indispensable. According to the data from IDC, the quantity of smartphone in 2012 is up to 0.68 billion and the demand will keep on growing in 2013.In this study, we will discuss if it is possible to use the existing resources to attaining vertical integration. Furthermore, packaging and testing industry can upgrade themselves from low gross margin situation, change management, overcome environmental threats and then pursuit sustainable management by product innovation. With the product and the management of L and S companies, we hope we can summarize a suggestion to innovative management in order to get rid of the low gross margin situation and the risk of being eliminated. Therefore, Taiwanese IC packaging and testing industry will create new opportunity and lead the globe.