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dc.contributor.authorLee, W.en_US
dc.contributor.authorSu, P.en_US
dc.date.accessioned2014-12-08T15:10:00Z-
dc.date.available2014-12-08T15:10:00Z-
dc.date.issued2009-02-11en_US
dc.identifier.issn0957-4484en_US
dc.identifier.urihttp://dx.doi.org/10.1088/0957-4484/20/6/065202en_US
dc.identifier.urihttp://hdl.handle.net/11536/7637-
dc.description.abstractThis paper systematically presents controlled single-electron effects in multiple- gate silicon-on-insulator (SOI) metal-oxide-semiconductor field-effect transistors (MOSFETs) with various gate lengths, fin widths, gate bias and temperature. Our study indicates that using the non-overlapped gate to source/drain structure as an approach to the single-electron transistor (SET) in MOSFETs is promising. Combining the advantage of gate control and the constriction of high source/drain resistances, single-electron effects are further enhanced using the multiple- gate architecture. From the presented results, downsizing multiple- gate SOI MOSFETs is needed for future room-temperature SET applications. Besides, the tunnel barriers and access resistances may need to be further optimized. Since the Coulomb blockade oscillation can be achieved in state-of-the-art complementary metal-oxide-semiconductor (CMOS) devices, it is beneficial to build SETs in low-power CMOS circuits for ultra-high-density purposes.en_US
dc.language.isoen_USen_US
dc.titleSingle-electron effects in non-overlapped multiple-gate silicon-on-insulator metal-oxide-semiconductor field-effect transistorsen_US
dc.typeArticleen_US
dc.identifier.doi10.1088/0957-4484/20/6/065202en_US
dc.identifier.journalNANOTECHNOLOGYen_US
dc.citation.volume20en_US
dc.citation.issue6en_US
dc.citation.epageen_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000262494200006-
dc.citation.woscount3-
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