微處理器核心熱分布量測與模擬平台之建構

Abstract

隨著先進處理器的發展，工作頻率和功耗快速上升到臨界點，隨之所帶來大量的熱能損耗，也讓處理器的工作頻率和表現受限在此，因此需要散熱的技術來讓處理器可以提升效能與可靠性。 也因為先進製程技術的精進，熱能損耗帶來更多的靜態耗電，耗電又會造成熱能的損耗，兩者相互影響加劇，所以為了要有效控制熱能損耗，熱能管理是現在重要的研究課題之一。 我們可以透過熱能管理來控制運作溫度，並有效提升處理器效能與可靠性，也可以降低熱損耗所帶來的靜態耗電。 為了要有效發展和使用熱能管理，獲得微處理器內部各個位置上精確的溫度資訊則是熱能管理中重要的第一步。 在本論文中，我們結合並創建模擬平台，可以在執行程式時，透過獲取核心中各個功能單元的效能計數器，來得到核心的溫度分布，並可以使用所得到的各功能單元的溫度，來計算因為熱能損耗所帶來的靜態耗電。 也搭配使用熱像儀，在實際的平台上，建立動態的熱能評估。

Modern CPUs with increasing core frequency and power are rapidly reaching a point where the CPU frequency and performance are limited by the amount of heat, then it need cooling technology to enhance performance and reliability. Because of the enhancement of the technology size, heat dissipation also result in more leakage power consumption and the increasing power will generate more heat then they will influence with each other heavily. Therefore, in order to decrease the temperature of the processors, it is the most important part about how to use Dynamic Thermal Management [24] to control the temperature in recent study topic. We can increase the performance and reliability of processors through efficiently using DTM to manage the operating temperature. To obtain detail thermal distribution of a microprocessor is one of critical tasks for thermal management which improves the reliability, performance, etc. of modern microprocessors significantly. In this thesis, we combine and construct the simulation platform to derive detailed temperature information of a microprocessor by catching the performance counters in each functional unit of the core when we run a program and we would use detailed temperature information to calculate the leakage power which generated from heat. At last, we will construct real time thermal estimation on the real platform with using the infrared camera.