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dc.contributor.authorWei, Lanen_US
dc.contributor.authorDeng, Jieen_US
dc.contributor.authorChang, Li-Wenen_US
dc.contributor.authorKim, Keunwooen_US
dc.contributor.authorChuang, Ching-Teen_US
dc.contributor.authorWong, H. -S. Philipen_US
dc.date.accessioned2014-12-08T15:10:02Z-
dc.date.available2014-12-08T15:10:02Z-
dc.date.issued2009-02-01en_US
dc.identifier.issn0018-9383en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TED.2008.2010573en_US
dc.identifier.urihttp://hdl.handle.net/11536/7663-
dc.description.abstractWe propose a path for extending the technology roadmap when currently considered technology boosters (e.g., strain, high-kappa/metal gate) reach their limits and physical gate length can no longer be effectively scaled down. By judiciously engineering the device parasitic resistance and parasitic capacitance, and considering the impact of the interconnect wiring capacitance, we propose scenarios of selective device structure scaling that will enable technology scaling and contacted gate pitch scaling for several generations beyond the currently perceived limits.en_US
dc.language.isoen_USen_US
dc.subjectCMOSen_US
dc.subjectcontacted gate pitchen_US
dc.subjectdevice geometryen_US
dc.subjectdevice scalingen_US
dc.subjectfootprinten_US
dc.subjectparasiticen_US
dc.titleSelective Device Structure Scaling and Parasitics Engineering: A Way to Extend the Technology Roadmapen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/TED.2008.2010573en_US
dc.identifier.journalIEEE TRANSACTIONS ON ELECTRON DEVICESen_US
dc.citation.volume56en_US
dc.citation.issue2en_US
dc.citation.spage312en_US
dc.citation.epage320en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000262816800022-
dc.citation.woscount13-
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