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dc.contributor.authorChen, William Po-Nienen_US
dc.contributor.authorSu, Pinen_US
dc.contributor.authorGoto, Ken-Ichien_US
dc.contributor.authorDiaz, Carlos H.en_US
dc.date.accessioned2014-12-08T15:10:19Z-
dc.date.available2014-12-08T15:10:19Z-
dc.date.issued2009en_US
dc.identifier.issn0013-4651en_US
dc.identifier.urihttp://hdl.handle.net/11536/7882-
dc.identifier.urihttp://dx.doi.org/10.1149/1.3005569en_US
dc.description.abstractThis paper presents a BSIM-based method for source/drain series resistance and mobility extraction in nanoscale strained-silicon metal oxide semiconductor field effect transistors (MOSFETs) with halo implants. This method is more accurate than the conventional channel-resistance and shift and ratio method because it considers the gate-length dependence of mobility caused by local uniaxial stress and laterally nonuniform channel doping. We have verified this method using samples with different stressor/doping conditions and good agreement with experimental data has been obtained. The accuracy of the Berkeley Short-channel IGFET model (BSIM) R(sd) extraction method is also proven by simulated current-voltage characteristics with different external resistant values. Significant mobility degradation in the short-channel regime has been observed for various uniaxial stressors. This method may serve as a suitable process monitor tool for ultrashallow junction and strained process development.en_US
dc.language.isoen_USen_US
dc.subjectMOSFETen_US
dc.subjectnanoelectronicsen_US
dc.titleSeries Resistance and Mobility Extraction Method in Nanoscale MOSFETsen_US
dc.typeArticleen_US
dc.identifier.doi10.1149/1.3005569en_US
dc.identifier.journalJOURNAL OF THE ELECTROCHEMICAL SOCIETYen_US
dc.citation.volume156en_US
dc.citation.issue1en_US
dc.citation.spageH34en_US
dc.citation.epageH38en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000261209800070-
dc.citation.woscount3-
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