标题: 射频电浆溅镀氮化铝在有机薄膜电晶体闸极绝缘层之应用
The Application of RF Sputtered AlN on the Gate Insulator of OTFTs
作者: 刘溥宽
Pu-Kuan Liu
冉晓雯
Hsiao-Wen Zan
光电工程学系
关键字: 五环素;氮化铝;有机薄膜电晶体;低电压;低温;Pentacene;AlN;OTFTs;Low-voltage;Low temperature
公开日期: 2005
摘要: 本论文中,低温(25℃-250℃)溅镀氮化铝(AlN)薄膜被沉积当作有机薄膜电晶体(OTFTs)上的闸极绝缘层。不同于传统的高介电常数的材料,氮化铝拥有低的闸极漏电以及高的疏水性。在实验中发现氮化铝的表面能比五环素(pentacene)还低而且近似于用自组装单层膜(SAM)处理过后的介电层。在实验中,尝试调整氮化铝的制程条件,我们发现当制程温度降低时,氮化铝可获得平整的表面(表面粗糙度小0.2nm)以及很低的闸极漏电(在1MV/cm,漏电流小于1×10-9A/cm2)。并且观察到崩溃电场大于5MV/cm以及量测到的氮化铝介电常数为7。除了降低温度外,当增加氮气流率比时,氮化铝漏电也获得抑制。更近一步分析漏电行为,发现氮化铝在低电场时,由欧姆(Ohmic)定律主导。在高电场时,由普尔-夫伦克尔(Poole-Frenkel)过程来主导。因此当增加氮气流率时,氮相关之缺陷可能获得补偿,漏电因此而降低。
根据最佳制程条件,我们实现了低电压操作的氮化铝有机薄膜电晶体。当氮化铝的厚度降低到70nm以下,氮化铝有机薄膜电晶体可以被操作在5伏特以下。并且可以获得高的电流开/关比值(大于10^6)以及高的载子移动率(约1.67cm2/V-sec)。而且也可得到极低的次临界摆幅(约130mV/decadec)和临界电压(约-1.5伏特)。然而由于氮化铝拥有低的表面能,可能导致低的介面捕获电荷密度和极小的次临界摆幅。这些显着的电晶体特性论证了氮化铝有机薄膜电晶体拥有极大的潜力,可以应用在低操作电压以及快速开关的有机电晶体上。
In this thesis, the low-temperature (25℃-250℃) sputtered aluminum nitride (AlN) film was deposited as the gate insulator in organic thin film transistors (OTFTs). In contrary to the conventional high-k dielectrics, the AlN film has a very low dielectric leakage and hydrophobic. The surface free energy is lower than the pentacene film and similar to the self-assembled monolayer (SAM) treated dielectrics. By adjusting the AlN sputtering process, it was found that the smooth (surface roughness <0.2nm) and very low leakage (less than 1×10-9A/cm2 at 1MV/cm) AlN film was obtained by lowering down the process temperature. The dielectric breakdown field is larger than 5MV/cm and the relative electrical permittivity is 7 in the AlN film. With the increasing of nitrogen gas flow rate, the dielectric leakage of AlN film is suppressed. Moreover, the leakage-current in AlN film obeys the Ohmic-conduction and the Poole-Frenkel transport in low and high electric field, respectively. It is suggested that the nitrogen-related defects are compensated, with the increasing of nitrogen flow rate in sputtering process, thus the leakage is decreased.
Accordingly to the optimized sputtering conditions, the low-voltage AlN-OTFTs is realized. With the thin AlN gate-dielectric (thickness less than 70nm), the AlN-OTFTs are operated at a very low voltage (less than 5V). It is founded that the high on/off current ratio more than 10^6, and the high mobility about 1.67cm2/V-sec are achievable. The lowest subthreshold swing is 130mV/decade and the threshold voltage is -1.5V. The low interface-trap-density and the steep subthreshold swing for AlN-OTFTs may be attributed to the low surface energy of the AlN film. The remarkable transistor properties demonstrate that the AlN-OTFT has potential application in low-voltage and rapid-switching organic transistors.
URI: http://140.113.39.130/cdrfb3/record/nctu/#GT009324511
http://hdl.handle.net/11536/79172
显示于类别:Thesis


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  1. 451101.pdf
  2. 451102.pdf
  3. 451103.pdf
  4. 451104.pdf
  5. 451105.pdf
  6. 451106.pdf
  7. 451107.pdf
  8. 451108.pdf
  9. 451109.pdf
  10. 451110.pdf

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