從數位生活趨勢以技術預測方法探討IC封裝型態之發展

Abstract

拜數位科技的迅速發展及經濟的進步之賜，全世界已邁入一個全新的數位化時代。而社會結構改變的影響，人們將可享有更便利地全新數位生活型態；影響所及，目前數位產品正快速的蓬勃發展，未來人們將可隨時隨地取得更多的資訊。未來數位生活型態的發展，將會呈現何種面貌，目前已有相當多的文獻探討；而未來的數位產品會如何發展，全世界亦有許多組織，正以有系統的方式定期討論其標準規格的訂定。但是對於最基本的數位產品本身，應該具備何種功能，以及其相關技術是否足夠成熟，或者其技術發展方向為何，目前尚無許多相關的研究。因此，本研究擬從未來數位生活的方向，推導出未來數位產品所需具備之功能，並採用MRI技術預測方法，藉由需求調查找出數位產品之技術需求，輔以此領域專家之技術調查，針對IC封裝技術之領域，找出未來數位產品所需之IC封裝關鍵技術，最後回過來定位出未來IC封裝技術發展趨勢，以及對產品開發及產業研究之建議，期望本研究能提供台灣半導體產業新的努力方向，並建立新的競爭優勢與核心競爭力。

According to the rapid progress of digital technology and economics growing, the world is entering a new digitalized life style. Since the social structure is going to change, people may have more choices for more convenient digital life. Hence, digital products are rapidly developing, people may access more information at anywhere. Regarding future digital life style forecasting, there are many related researches involved. Regarding the future digital products & trend, there are many worldwide organizations are discussing the standards and are defining the specification. But for the digital products producing, there are few researches study the required function, technology maturity and the technology development trend. Through this research, will be started on the future digital life style study. Then, collected the necessary functions from the digital life scenario. And found out the seed technologies using MRI technology forecasting method, as well as the technical survey from IC packaging specialists. However, this research is focus on IC packing field, the IC packaging key technologies for future digital products will be found accordingly. According the result, the IC packaging technology development direction will be determined finally. Some suggestions on future products development and industry research direction will be proposed. Hope this research could provide the new development direction for Taiwan semiconductor industry. And result to build up the new competitive strength and core competition.