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dc.contributor.authorTsui, Bing-Yueen_US
dc.contributor.authorLu, Chi-Peien_US
dc.contributor.authorLiu, Hsiao-Hanen_US
dc.date.accessioned2014-12-08T15:11:01Z-
dc.date.available2014-12-08T15:11:01Z-
dc.date.issued2008-09-01en_US
dc.identifier.issn0741-3106en_US
dc.identifier.urihttp://dx.doi.org/10.1109/LED.2008.2001478en_US
dc.identifier.urihttp://hdl.handle.net/11536/8431-
dc.description.abstractThe modified Schottky barrier (MSB) MOSFET with low-resistance metal source/drain and good short-channel effect immunity is one of the promising nanoscale device structures. In this letter, a modified external load resistance method was proposed to extract the bias-dependent source injection resistance of the MSB MOSFET for the first time. The effect of the thermal budget of the MSB process on the source injection resistance is reported. The injection resistance is exponentially proportional to (V-GS-V-th-0.5V(DS)) and would, be close to the source/drain resistance of conventional MOSFETs at high gate bias. This work provides a good method to directly evaluate the efficiency of the MSB junction.en_US
dc.language.isoen_USen_US
dc.subjectcarrier injectionen_US
dc.subjectimplantation-to-silicide (ITS)en_US
dc.subjectmodified Schottky barrier (MSB)en_US
dc.subjectmultigate FET (MuGFET)en_US
dc.titleMethod for extracting gate-voltage-dependent source injection resistance of modified Schottky barrier (MSB) MOSFETsen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/LED.2008.2001478en_US
dc.identifier.journalIEEE ELECTRON DEVICE LETTERSen_US
dc.citation.volume29en_US
dc.citation.issue9en_US
dc.citation.spage1053en_US
dc.citation.epage1055en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000259573400026-
dc.citation.woscount4-
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