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dc.contributor.authorYang, H. J.en_US
dc.contributor.authorCheng, C. F.en_US
dc.contributor.authorChen, W. B.en_US
dc.contributor.authorLin, S. H.en_US
dc.contributor.authorYeh, F. S.en_US
dc.contributor.authorMcAlister, Sean P.en_US
dc.contributor.authorChin, Alberten_US
dc.date.accessioned2014-12-08T15:11:24Z-
dc.date.available2014-12-08T15:11:24Z-
dc.date.issued2008-06-01en_US
dc.identifier.issn0018-9383en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TED.2008.920973en_US
dc.identifier.urihttp://hdl.handle.net/11536/8753-
dc.description.abstractWe have studied the nitrogen composition dependence of the characteristics of TaN/HfLaON/Hf(1-x-y)N(x)O(y)/ SiO(2)/Si MONOS memory devices. By increasing the N composition in the Hf(1-x-y)N(x)O(y) trapping layer, both the memory window And high-temperature retention improved. The Hf(0.3)N(0.2)O(0.5) MONOS device displayed good characteristics in terms of its +/-9-V program/erase (P/E) voltage, 100-mu s P/E speed, large initial 2.8-V memory window, and a ten-year extrapolated retention of 1.8 V at 85 degrees C or 1.5 V at 125 degrees C.en_US
dc.language.isoen_USen_US
dc.subjecteraseen_US
dc.subjecthigh-kappaen_US
dc.subjectnonvolatile memoryen_US
dc.subjectprogramen_US
dc.titleComparison of MONOS memory device integrity when using Hf(1-x-y)N(x)O(y) trapping layers with different N compositionsen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/TED.2008.920973en_US
dc.identifier.journalIEEE TRANSACTIONS ON ELECTRON DEVICESen_US
dc.citation.volume55en_US
dc.citation.issue6en_US
dc.citation.spage1417en_US
dc.citation.epage1423en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000256155600019-
dc.citation.woscount33-
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