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dc.contributor.authorChen, Jingkuangen_US
dc.contributor.authorCheng, Xiaoyangen_US
dc.contributor.authorChen, Chien-Changen_US
dc.contributor.authorLi, Pai-Chien_US
dc.contributor.authorLiu, Jian-Hungen_US
dc.contributor.authorCheng, Yu-Tingen_US
dc.date.accessioned2014-12-08T15:11:27Z-
dc.date.available2014-12-08T15:11:27Z-
dc.date.issued2008-06-01en_US
dc.identifier.issn1057-7157en_US
dc.identifier.urihttp://dx.doi.org/10.1109/JMEMS.2009.922076en_US
dc.identifier.urihttp://hdl.handle.net/11536/8782-
dc.description.abstractA capacitive micromachined ultrasonic transducer (CMUT) array for minimally invasive medical diagnosis has been developed. Unlike traditional ultrasonic transducers, which generally use a bulky piece of substrate, this transducer array was integrated on a 40-mu m-thick micromachined silicon substrate into a probe shape with a typical shank width of 50-80 mu m and a shank length of 4-8 mm. For 1-D arrays, 24-96 CMUT devices were integrated on one such silicon probe and formed an accurately configured phase array. In addition to miniaturization, reduction of the substrate thickness also decreases the intertransducer crosstalk due to substrate Lamb waves. Due to its miniature size, this array can be placed or implanted close to the target tissue/organ and can perform high-resolution high-precision diagnosis and stimulation using high-frequency ultrasounds. The issue of conflict between resolution and penetration depth of ultrasonic diagnosis can therefore be resolved. A two-layer polysilicon surface micromachining process was used to fabricate this device. Suspended polysilicon membranes of diameters ranging from 20 to 90 mu ms and thicknesses from 1.0 to 2.5 mu m were used to generate and detect ultrasounds of frequencies ranging from I to 10 MHz. B-mode imaging using this transducer array has been demonstrated.en_US
dc.language.isoen_USen_US
dc.subjectacoustic devicesen_US
dc.subjectacoustic transducersen_US
dc.subjectactuatorsen_US
dc.titleA capacitive micromachined ultrasonic transducer array for minimally invasive medical diagnosisen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/JMEMS.2009.922076en_US
dc.identifier.journalJOURNAL OF MICROELECTROMECHANICAL SYSTEMSen_US
dc.citation.volume17en_US
dc.citation.issue3en_US
dc.citation.spage599en_US
dc.citation.epage610en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000256626300008-
dc.citation.woscount11-
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