低溫無接面多晶矽電晶體技術開發

Full metadata record

DC Field	Value	Language
dc.contributor.author	黃調元	en_US
dc.contributor.author	HUANG TIAO-YUAN	en_US
dc.date.accessioned	2014-12-13T10:31:03Z	-
dc.date.available	2014-12-13T10:31:03Z	-
dc.date.issued	2013	en_US
dc.identifier.govdoc	NSC102-2221-E009-133	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/90668	-
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=3086753&docId=415126	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.language.iso	zh_TW	en_US
dc.title	低溫無接面多晶矽電晶體技術開發	zh_TW
dc.title	Development of Low-Temperature Junctionless Poly-Si Device Technologies	en_US
dc.type	Plan	en_US
dc.contributor.department	國立交通大學電子工程學系及電子研究所	zh_TW
Appears in Collections:	Research Plans