晶圓封裝打線製程之電腦視覺檢測與品質管制研究(I)

標題:	晶圓封裝打線製程之電腦視覺檢測與品質管制研究(I) Vision Inspection and SPC Study for Wafer Wire-Bond Packaging (I)
作者:	彭德保 PERNG DER-BAAU 國立交通大學工業工程與管理學系
公開日期:	2003
官方說明文件#:	NSC92-2213-E009-103
URI:	http://hdl.handle.net/11536/91839 https://www.grb.gov.tw/search/planDetail?id=843508&docId=159796
Appears in Collections:	Research Plans

Files in This Item:

If it is a zip file, please download the file and unzip it, then open index.html in a browser to view the full text content.