Full metadata record
DC FieldValueLanguage
dc.contributor.author郭建男en_US
dc.contributor.authorKUO CHIEN-NANen_US
dc.date.accessioned2014-12-13T10:33:28Z-
dc.date.available2014-12-13T10:33:28Z-
dc.date.issued2003en_US
dc.identifier.govdocNSC92-2220-E009-007zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/92084-
dc.identifier.urihttps://www.grb.gov.tw/search/planDetail?id=844260&docId=159993en_US
dc.description.sponsorship行政院國家科學委員會zh_TW
dc.language.isozh_TWen_US
dc.title用於寬頻通信之高性能單一載具整合晶片系統---子計畫II:應用系統構裝技術之多頻射頻前端積體電路(I)zh_TW
dc.titleMulti-Band RF Front-End Integrated Circuits in System-on-Package Technology (I)en_US
dc.typePlanen_US
dc.contributor.department國立交通大學電子工程學系zh_TW
Appears in Collections:Research Plans


Files in This Item:

  1. 922220E009007.pdf

If it is a zip file, please download the file and unzip it, then open index.html in a browser to view the full text content.