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dc.contributor.authorCheng, Chun-Huen_US
dc.contributor.authorYeh, Fon-Shanen_US
dc.contributor.authorChin, Alberten_US
dc.date.accessioned2014-12-08T15:12:08Z-
dc.date.available2014-12-08T15:12:08Z-
dc.date.issued2011-02-15en_US
dc.identifier.issn0935-9648en_US
dc.identifier.urihttp://dx.doi.org/10.1002/adma.201002946en_US
dc.identifier.urihttp://hdl.handle.net/11536/9298-
dc.description.abstractVery high performance Ni/GeO(x)/HfON/TaN non-volatile resistive memory is fabricated using the covalently bonded dielectric GeO(x) and metal oxynitride HfON, as well as low cost electrodes. The device shows low set and reset powers, good 85 degrees C retention, and 10(5) endurance, which are near to the characteristics of existing commercial flash memory.en_US
dc.language.isoen_USen_US
dc.titleLow-Power High-Performance Non-Volatile Memory on a Flexible Substrate with Excellent Enduranceen_US
dc.typeArticleen_US
dc.identifier.doi10.1002/adma.201002946en_US
dc.identifier.journalADVANCED MATERIALSen_US
dc.citation.volume23en_US
dc.citation.issue7en_US
dc.citation.spage902en_US
dc.citation.epage+en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000287668500016-
dc.citation.woscount51-
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