具實用性及交期導向之IC封裝廠排程演算法則之設計與應用

Full metadata record

DC Field	Value	Language
dc.contributor.author	彭文理	en_US
dc.contributor.author	WEN LEAPEARN	en_US
dc.date.accessioned	2014-12-13T10:35:46Z	-
dc.date.available	2014-12-13T10:35:46Z	-
dc.date.issued	2001	en_US
dc.identifier.govdoc	NSC90-2218-E009-019	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/93590	-
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=674285&docId=128524	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.language.iso	zh_TW	en_US
dc.subject	IC封裝	zh_TW
dc.subject	排程	zh_TW
dc.subject	演算法	zh_TW
dc.subject	交期指定	zh_TW
dc.subject	實用性	zh_TW
dc.subject	IC packaging	en_US
dc.subject	Scheduling	en_US
dc.subject	Algorithm	en_US
dc.subject	Due date assignment	en_US
dc.subject	Practicability	en_US
dc.title	具實用性及交期導向之IC封裝廠排程演算法則之設計與應用	zh_TW
dc.title	The Design and Application of the Algorithms with Practicability and Due-Date Orientation for Solving the IC Packaging Scheduling Problem (ICPSP)	en_US
dc.type	Plan	en_US
dc.contributor.department	國立交通大學工業工程與管理學系	zh_TW
Appears in Collections:	Research Plans

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