Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 邱碧秀 | en_US |
| dc.contributor.author | CHIOU BI-SHIOU | en_US |
| dc.date.accessioned | 2014-12-13T10:36:17Z | - |
| dc.date.available | 2014-12-13T10:36:17Z | - |
| dc.date.issued | 2000 | en_US |
| dc.identifier.govdoc | NSC89-2216-E009-037 | zh_TW |
| dc.identifier.uri | http://hdl.handle.net/11536/93845 | - |
| dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=584706&docId=109910 | en_US |
| dc.description.sponsorship | 行政院國家科學委員會 | zh_TW |
| dc.language.iso | zh_TW | en_US |
| dc.title | 高密度多層構裝基板與接合材料研究---總計畫(II) | zh_TW |
| dc.title | A Study on High Density Multilayer Substrate and Interconnection Materials(II) | en_US |
| dc.type | Plan | en_US |
| dc.contributor.department | 國立交通大學電子工程學系 | zh_TW |
| Appears in Collections: | Research Plans | |
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