完整後設資料紀錄
| DC 欄位 | 值 | 語言 |
|---|---|---|
| dc.contributor.author | 韋光華 | en_US |
| dc.contributor.author | KUNG-HWAWEI | en_US |
| dc.date.accessioned | 2014-12-13T10:36:44Z | - |
| dc.date.available | 2014-12-13T10:36:44Z | - |
| dc.date.issued | 1999 | en_US |
| dc.identifier.govdoc | NSC88-CPC-E009-007 | zh_TW |
| dc.identifier.uri | http://hdl.handle.net/11536/94133 | - |
| dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=460500&docId=84321 | en_US |
| dc.description.sponsorship | 行政院國家科學委員會 | zh_TW |
| dc.language.iso | zh_TW | en_US |
| dc.subject | 聚亞醯胺 | zh_TW |
| dc.subject | 納米複合材料 | zh_TW |
| dc.subject | 積體電路 | zh_TW |
| dc.subject | 構裝 | zh_TW |
| dc.subject | 機械性質 | zh_TW |
| dc.subject | Polyimide | en_US |
| dc.subject | Nanocomposite | en_US |
| dc.subject | Integrated circuit | en_US |
| dc.subject | Packaging | en_US |
| dc.subject | Mechanical property | en_US |
| dc.title | 積體電路化學品與材料之開發---子計畫VI：積體電路封裝用聚亞醯胺納米複合材料材機械及電氣性質之研究(II) | zh_TW |
| dc.title | A Study on the Mechanical and Electrical Properties of Polyimide Nancomposites for Integrated Circuit Packaging Application (II) | en_US |
| dc.type | Plan | en_US |
| dc.contributor.department | 交通大學材料科學與工程研究所 | zh_TW |
| 顯示於類別： | 研究計畫 | |
