| Title: | 積體電路化學品與材料之開發---子計畫IV：積體電路封裝用含矽基聚亞醯胺材料之製備及相關性質研究(II) A Study on Synthesis and Characteristics of Silicon-Containing Polyimide for IC Package Application(II) |
| Authors: | 黃華宗 WHANG WHA-TZONG 交通大學材料科學與工程研究所 |
| Keywords: | 含矽高分子;聚亞醯胺;積體電路;構裝;合成;Silicone polymer;Polyimide;Integrated circuit (IC);Package;Synthesis |
| Issue Date: | 1999 |
| Gov't Doc #: | NSC88-CPC-E009-008 |
| URI: | http://hdl.handle.net/11536/94194 https://www.grb.gov.tw/search/planDetail?id=460592&docId=84348 |
| Appears in Collections: | Research Plans |
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