Full metadata record
DC FieldValueLanguage
dc.contributor.author林木獅en_US
dc.contributor.authorLIN MU-SHIHen_US
dc.date.accessioned2014-12-13T10:36:50Z-
dc.date.available2014-12-13T10:36:50Z-
dc.date.issued1999en_US
dc.identifier.govdocNSC88-CPC-E009-006zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/94210-
dc.identifier.urihttps://www.grb.gov.tw/search/planDetail?id=460589&docId=84347en_US
dc.description.sponsorship行政院國家科學委員會zh_TW
dc.language.isozh_TWen_US
dc.subject熱固型zh_TW
dc.subject聚亞醯胺zh_TW
dc.subject積體電路zh_TW
dc.subject封裝材料zh_TW
dc.subject合成zh_TW
dc.subjectThermoseten_US
dc.subjectPolyimideen_US
dc.subjectIntegrated circuit (IC)en_US
dc.subjectEncapsulanten_US
dc.subjectSynthesisen_US
dc.title積體電路(IC)化學品及材料開發---子計畫V:積體電路封裝用熱固型聚亞醯胺之研製及特性研究(II)zh_TW
dc.titlePreparation and Characterization of Thermosetting Polyimides Used in IC Encapsulants (II)en_US
dc.typePlanen_US
dc.contributor.department交通大學應用化學研究所zh_TW
Appears in Collections:Research Plans