完整後設資料紀錄
| DC 欄位 | 值 | 語言 |
|---|---|---|
| dc.contributor.author | 林木獅 | en_US |
| dc.contributor.author | LIN MU-SHIH | en_US |
| dc.date.accessioned | 2014-12-13T10:36:50Z | - |
| dc.date.available | 2014-12-13T10:36:50Z | - |
| dc.date.issued | 1999 | en_US |
| dc.identifier.govdoc | NSC88-CPC-E009-006 | zh_TW |
| dc.identifier.uri | http://hdl.handle.net/11536/94210 | - |
| dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=460589&docId=84347 | en_US |
| dc.description.sponsorship | 行政院國家科學委員會 | zh_TW |
| dc.language.iso | zh_TW | en_US |
| dc.subject | 熱固型 | zh_TW |
| dc.subject | 聚亞醯胺 | zh_TW |
| dc.subject | 積體電路 | zh_TW |
| dc.subject | 封裝材料 | zh_TW |
| dc.subject | 合成 | zh_TW |
| dc.subject | Thermoset | en_US |
| dc.subject | Polyimide | en_US |
| dc.subject | Integrated circuit (IC) | en_US |
| dc.subject | Encapsulant | en_US |
| dc.subject | Synthesis | en_US |
| dc.title | 積體電路(IC)化學品及材料開發---子計畫V：積體電路封裝用熱固型聚亞醯胺之研製及特性研究(II) | zh_TW |
| dc.title | Preparation and Characterization of Thermosetting Polyimides Used in IC Encapsulants (II) | en_US |
| dc.type | Plan | en_US |
| dc.contributor.department | 交通大學應用化學研究所 | zh_TW |
| 顯示於類別： | 研究計畫 | |
