Title: 極大型積體電路之深次微米元件及多層連線分析及模擬的研究(II)
Characterization and Modeling Techniques of Deep-Submicrometer Devices and Multi-Layer Interconnection for ULSI Circuits (II)
Authors: 吳慶源
交通大學電子工程系
Keywords: 極大型積體電路;多層連線;深次微米;模型建立;可靠度;金氧半場效電晶體;快閃式記憶體;ULSI;Multi-layer interconnection;Deep submicrometer;Modeling;Reliability;MOSFET;Flash memory
Issue Date: 1999
Gov't Doc #: NSC88-2215-E009-039
URI: http://hdl.handle.net/11536/94341
https://www.grb.gov.tw/search/planDetail?id=418058&docId=74157
Appears in Collections:Research Plans


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