高密度電子構裝接合與測試載具之開發---總計畫(III)

標題:	高密度電子構裝接合與測試載具之開發---總計畫(III) A Development of Bonding Technology and Test Vehicle for High-Density Electronic Packaging (III)
作者:	邱碧秀 CHIOU BI-SHIOU 交通大學電子工程系
關鍵字:	電子封裝;多晶片模組;多層連線結構;基板製造;晶片接合;Electronic package;Multichip model (MCM);Multilayer interconnection structure;Substrate fabrication;Chip interconnection
公開日期:	1999
官方說明文件#:	NSC88-2216-E009-011
URI:	http://hdl.handle.net/11536/94408 https://www.grb.gov.tw/search/planDetail?id=429228&docId=76835
Appears in Collections:	Research Plans

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