超大型積體電路中連接導線之銅材及障礙層微結構及特性研究

標題:	超大型積體電路中連接導線之銅材及障礙層微結構及特性研究 Microstructural Study of Copper and Its Alloys for Interconnect Application in ULSI
作者:	張立 CHANG LI 交通大學材料科學與工程研究所
關鍵字:	金屬化;擴散阻礙;濺鍍;銅;Metallization;Diffusion barrier;Sputtering;Copper
公開日期:	1999
官方說明文件#:	NSC88-2215-E009-027
URI:	http://hdl.handle.net/11536/94455 https://www.grb.gov.tw/search/planDetail?id=444285&docId=80462
Appears in Collections:	Research Plans

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