Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 陳智 | en_US |
dc.contributor.author | Chen Chih | en_US |
dc.date.accessioned | 2014-12-13T10:38:16Z | - |
dc.date.available | 2014-12-13T10:38:16Z | - |
dc.date.issued | 2001 | en_US |
dc.identifier.govdoc | NSC90-2216-E009-042 | zh_TW |
dc.identifier.uri | http://hdl.handle.net/11536/95187 | - |
dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=673300&docId=128275 | en_US |
dc.description.sponsorship | 行政院國家科學委員會 | zh_TW |
dc.language.iso | zh_TW | en_US |
dc.subject | 無鉛銲錫 | zh_TW |
dc.subject | 電子遷移 | zh_TW |
dc.subject | Lead-free solder | en_US |
dc.subject | Electromigration | en_US |
dc.title | 無鉛銲錫的電遷移研究 | zh_TW |
dc.title | A Systematic Study of Electromigration in Pb-free Solders | en_US |
dc.type | Plan | en_US |
dc.contributor.department | 國立交通大學材料科學與工程學系 | zh_TW |
Appears in Collections: | Research Plans |
Files in This Item:
If it is a zip file, please download the file and unzip it, then open index.html in a browser to view the full text content.