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標題: 覆加銅層之厚膜銀基導體研究
Cu-Modified Thick Film Ag-Based Conductor
作者: 邱碧秀
CHIOU BI-SHIOU
國立交通大學電子工程研究所
公開日期: 1995
官方說明文件#: NSC84-2215-E009-053
URI: http://hdl.handle.net/11536/96692
https://www.grb.gov.tw/search/planDetail?id=169492&docId=28445
Appears in Collections:Research Plans


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  • TEMPERATURE CYCLING EFFECTS BETWEEN SN/PB SOLDER AND THICK-FILM PD/AG CONDUCTOR METALLIZATION / CHIOU, BS;LIU, KC;DUH, JG;PALANISAMY, PS
  • INTERMETALLIC FORMATION ON THE FRACTURE OF SN/PB SOLDER AND PD/AG CONDUCTOR INTERFACES / CHIOU, BS;LIU, KC;DUH, JG;PALANISAMY, PS
  • The CVD growth of Cu films using H-2 as carrier gas / Lin, PJ;Chen, MC
  • Microstructural evolution and bonding mechanisms of the brazed Ti/ZrO2 joint using an Ag68.8Cu26.7Ti4.5 interlayer at 900 degrees C / Wei, Shen-Hung;Lin, Chien-Cheng
  • Metallurgical reaction of the Sn-3.5Ag solder and Sn-37Pb solder with Ni/Cu under-bump metallization in a flip-chip package / Huang, CS;Duh, JG;Chen, YM
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引用(Cite)
APA 邱., & CHIOU B. (1995). 覆加銅層之厚膜銀基導體研究. https://www.grb.gov.tw/search/planDetail?id=169492&docId=28445.
Bibtex @article{1995,
    title={覆加銅層之厚膜銀基導體研究},
    author={邱碧秀 and CHIOU BI-SHIOU},
    journal={https://www.grb.gov.tw/search/planDetail?id=169492&docId=28445},
    year={1995},
    url={https://ir.lib.nycu.edu.tw/handle/11536/96692?locale=en},
}